| Old | New | Differences | |
|---|---|---|---|
| 1 | 1 | 89R4891 JRR-D | |
| 2 | 2 | By: Luther H.B. No. 1946 | |
| 3 | 3 | ||
| 4 | 4 | ||
| 5 | 5 | ||
| 6 | 6 | ||
| 7 | 7 | A BILL TO BE ENTITLED | |
| 8 | 8 | AN ACT | |
| 9 | 9 | relating to the denial of certain applications for a permit or other | |
| 10 | 10 | authorization under the Texas Clean Air Act on the basis of | |
| 11 | 11 | proximity to a semiconductor wafer manufacturing facility. | |
| 12 | 12 | BE IT ENACTED BY THE LEGISLATURE OF THE STATE OF TEXAS: | |
| 13 | 13 | SECTION 1. Subchapter C, Chapter 382, Health and Safety | |
| 14 | 14 | Code, is amended by adding Section 382.0595 to read as follows: | |
| 15 | 15 | Sec. 382.0595. DENIAL OF CERTAIN APPLICATIONS FOR PERMIT OR | |
| 16 | 16 | OTHER AUTHORIZATION ON BASIS OF PROXIMITY TO SEMICONDUCTOR WAFER | |
| 17 | 17 | MANUFACTURING FACILITY. (a) In this section, "semiconductor wafer | |
| 18 | 18 | manufacturing facility" means a manufacturing facility that | |
| 19 | 19 | includes any of the following processes with respect to | |
| 20 | 20 | semiconductor production: | |
| 21 | 21 | (1) growing single-crystal ingots or boules; | |
| 22 | 22 | (2) wafer slicing; | |
| 23 | 23 | (3) etching and polishing; | |
| 24 | 24 | (4) bonding; | |
| 25 | 25 | (5) cleaning; | |
| 26 | 26 | (6) epitaxial deposition; or | |
| 27 | 27 | (7) metrology. | |
| 28 | 28 | (b) Notwithstanding any other law, the commission shall | |
| 29 | 29 | deny an application for a permit or other authorization under this | |
| 30 | 30 | chapter that is subject to new source review if the permit or other | |
| 31 | 31 | authorization is for a permanent cement production plant, including | |
| 32 | 32 | a cement kiln, that will be located within 10 miles of a | |
| 33 | 33 | semiconductor wafer manufacturing facility. | |
| 34 | 34 | SECTION 2. This Act takes effect September 1, 2025. |